P-A-2-33

Processing at: Nebraska

Flip-Chip Bonder: FC150
Update Bonder

Status: Encapsulated
Update Status


Last Modified: 2016-02-25 17:46:41

Comprised of:
Sensor: WL_CL_911
HDI: YHC69-1015-2-33
ROCs (200um):

ROC0

ROC1

ROC2

ROC3

ROC4

ROC5

ROC6

ROC7

ROC15

ROC14

ROC13

ROC12

ROC11

ROC10

ROC9

ROC8


IV/CV Scans:

I(V=150) < 2uAI(V=150)/I(V=100) < 10
On Wafer:

PASS

PASS

Bare Module:

PASS

PASS

Fully Assembled:

FAIL

PASS

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No CV scan data for this part



2015-04-16 15:11:37
2015-04-16 15:12:23
2015-04-16 15:13:08
2015-04-16 15:15:48
2015-04-16 15:32:16


Notes:

2015-04-10 18:07:38 Received
2015-04-16 15:14:35 Inspected by Joaquin Siado
2015-04-16 15:14:35 ok
2015-04-16 15:15:08 IV Tested by Joaquin Siado
2015-04-16 15:15:08 Compliance at -410V
2015-04-16 15:16:18 Ready for HDI Assembly by Joaquin Siado
2015-04-17 13:29:42 HDI Attached by Jose Monroy
2015-04-18 20:22:11 Wirebonded by Brian Farleigh
2015-04-18 20:22:11 Wirebonded on 4-13-2015, see http://t3-sl5.unl.edu:8175/SiLab_Logbook/719
2015-04-18 20:26:03 Encapsulated by José Monroy
2015-04-18 20:26:03 Damaged wirebonds, see http://t3-sl5.unl.edu:8175/SiLab_Logbook/741
Module needs repair.
2016-02-25 17:46:54 Module shipped back to UNL for wirebonding tests     --Petra